On April 19, 2024, SK hynix announced that the company would closely collaborate with TSMC (Taiwan Semiconductor Manufacturing Company) on the production of next-generation HBM (High Bandwidth Memory) products and the enhancement of advanced packaging technology integrating HBM with logic layers. The two parties recently signed a Memorandum of Understanding (MOU). The company plans to cooperate with TSMC to develop HBM4, the sixth-generation HBM product, expected to be in production by 2026.
SK hynix stated, "As a leader in the storage field for AI applications, the company will continue to lead HBM technology innovation through close collaboration with the world's leading logic foundry, TSMC. By establishing a tripartite technical cooperation among IC design factories, wafer fabrication factories, and memory factories, the company will achieve new breakthroughs in memory product performance."
The two companies will initially focus on performance improvements for the base die, which is the bottom layer of the HBM package. HBM stacks multiple DRAM (Dynamic Random Access Memory) dies on the base die and connects them vertically using TSV (Through-Silicon Via) technology. The base die also connects to the GPU, controlling the HBM.
Previous HBM products from SK hynix, including HBM3E (the fifth-generation HBM product), were manufactured based on the company's own process technology for the base die. However, starting with HBM4, SK hynix plans to adopt TSMC's advanced logic process technology. Using advanced process technology for the base die can add more functionality. Consequently, the company plans to produce customized HBM products that meet a wider range of customer needs in terms of performance and efficiency.
Meanwhile, the two parties will collaborate to optimize the integration of SK hynix's HBM products with TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology to address the requirements of HBM-related customers.
President of SK hynix's AI Infra Division, Jin Joo-sun, said, "Through our partnership with TSMC, the company will not only develop the highest performing HBM4 but also actively expand open collaboration with global customers. In the future, the company will enhance the competitiveness of its customized memory platform to solidify its position as a comprehensive supplier of AI-oriented memory."
Zhang Xiaoqiang, Senior Vice President and Co-General Manager of Business Development and Overseas Operations Office at TSMC, stated, "Over the years, TSMC and SK hynix have built a strong partnership. By combining the most advanced logic process with HBM products, we provide globally leading AI solutions to the market. Looking ahead to the new generation of HBM4, we believe that through close collaboration, both companies will provide the best integrated products, serving as a key driving force for new AI innovations for our mutual customers."
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